Gnomit / Keyword Search / Info
Gnomit ? ? ?
Results 1 - 1 of 1 for:
memory modules
1
multi-chip
1 ?
 21,213,375 websites (safe search)

  1. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
    ball grid array1
    advanced packaging1
    micro BGA1
    chip scale1
    DDR II1
    FBGA1
    fold-over1
    chip scale package1
    UBGA1
    3D packaging1
    land grid array1
    3D package1
    integrated passives1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    package solutions1
    chip scale technology1
    compliant chip1
    compliant layer1
    multi-chip1
    MBGA1
    microZ miniaturization1
    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

dram1 memory3 flash5 assembly2 actionscript2 gry2 for sale4 digital cameras3 chip scale package1 ball grid array1 csp1 animation4 bga1 laptops3 pcb2 software7 cell phones3 dimm1 abr2

About Gnomit
Keywords may contain spaces.
Separate multiple keywords with commas.
Start a new search.
Enter new keyword(s).
Narrow down your search.
Add keyword(s).
Broaden your search.
Click on Keyword to remove from query.